Lenthor Engineering - Flex and Rigid-Flex Board Capability

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LENTHOR ANNOUNCES

5/6/10
Lenthor Purchases Orbotech OLB AOI System
Lenthor Engineering purchased a new Orbotech Discovery ™ OLB Automated Optical Inspection system while at the IPC Apex show last month

2/22/10
Lenthor Engineering Adds IPS/WTA Shadow Line
Lenthor has purchased an IPS/WTA shadow line at auction

2/22/10
Lenthor Engineering Hires Michael Newman in Engineering
Lenthor is happy to announce that Michael Newman will be joining the Lenthor Engineering team, in the position of Applications Engineer.

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Flex and Rigid-Flex Board Capability
Description	Standard (Mils)	Supported (Mils)
Drill Hole to Copper Features Outer Layer Inner Layer - Signal Inner Layer - Plane	0.010 0.012 0.015	0.008 0.010 0.012
Drill Via Size Flex Rigid-Flex .040 Rigid-Flex .062 Rigid-Flex .093 Blind laser Via's	0.008 0.010 0.012 0.016 0.010	0.004 0.008 0.008 0.015 0.008
Annular Ring Print and Plate Pads Plate Laser Via Capture Pads	0.005 0.010 0.006	0.004 0.006 0.005
Trace Width 1 oz (0.0014) 1/2 oz (0.0007)	0.005 0.004	0.003 0.003
Spacing 1 oz (0.0014) 1/2 oz (0.0007)	0.005 0.004	0.004 0.0035
Misc. Silkscreen Line Width Copper to Board Edge Hole Size Tolerance Coverlay Opening Coverlay Web (Kapton) Layer Count Core Thickness (Rigid) Core Thickness (Flex) Processes	0.007 0.010 0.006 0.005 annular ring 0.010 20 0.005 0.002 Bikini Prepreg Pouchless	0.005 0.007 0.004 0.003 annular ring 0.006 24 0.003 0.001